Detailed close-up of a microprocessor circuit board showcasing intricate circuitry and components.

semiconductor chiplet architecture

Chiplet Ecosystem

The Architecture of Next-Gen Silicon

Latest Research

How Chiplet Thermal Interface Material Selection Locks In Junction Temperature Before Any Simulation Runs

The thermal interface material between a chiplet and its heat spreader sets junction temperature ceilings before simulation even starts. Here's why that choice matters so early.

P. Nakamura

· September 21, 2026 · 5 min read

advanced packaging heterogeneous integration

How Chiplet Assembly Sequence Locks In Rework Cost Before a Single Die Is Bonded

The order in which chiplet dies are assembled onto a substrate or interposer quietly determines whether rework is feasible or financially catastrophic.

P. Nakamura

· September 14, 2026 · 4 min read

chiplet design redundancy

How Chiplet Redundancy Schemes Reshape Die Area Budgets Before Yield Models Are Built

Chiplet redundancy strategies force die area tradeoffs that ripple through packaging decisions long before yield models or logic partitioning begin.

P. Nakamura

· September 7, 2026 · 5 min read

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