The Architecture of Next-Gen Silicon
When chiplets from different process nodes share a package, power domain isolation stops being a design afterthought and becomes a packaging problem that must be solved before floorplanning begins.
P. NakamuraProtocol overhead in chiplet interconnects consumes meaningful die area before logic synthesis begins, and most teams discover this far too late in the design flow.
P. NakamuraReticle size limits at advanced nodes force chiplet partitioning decisions that lock in die count, interconnect topology, and yield math before RTL ever loads.
P. Nakamura